Semiconductor module



FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a front, right, and bottom perspective view thereof;

FIG. 8 is a rear, left, and top perspective view thereof; and,

FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 1.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. Plate shaped terminals are provided on the left side and right side. A plurality of post shaped pins extend from a rear surface. The cross-sections of the post shaped pins are rhombic. A hole penetrates from a front surface to the rear surface at each of four corners of the semiconductor module.

The broken lines shown in the drawing views of FIGS. 1-8 form no part of the claimed design. 

CLAIM The ornamental design for a semiconductor module, as shown and described. 